by Mike Benson | Apr 5, 2019 | Power, Press Releases
TDK announces the introduction of the DRM40 series of DIN rail mount redundancy modules. Two 10V to 30Vdc inputs are rated at 20A each and the output at 40A. A 150% peak load capability for four seconds is provided for capacitive and inductive loading. The internal...
by Mike Benson | Mar 5, 2019 | Sensors
The MCP6C02 is Microchip’s first zero-drift current sense amplifier, featuring industry leading performance including ultra-low input offset error and low offset drift, enabling higher measurement accuracy across a wide range of conditions. The need to accurately...
by Mike Benson | Mar 1, 2019 | Embedded/Processing, Wireless
On January 28th the Bluetooth Special Interest Group (SIG) released a new v5.1 version of the Bluetooth Core Specification supporting a brand-new feature called Direction Finding. This enhances existing Bluetooth Locationing Services with improved accuracy in...
by Mike Benson | Feb 26, 2019 | Press Releases
Platform Security Architecture (PSA) certification scheme, PSA Certified Level 1 certification to improve IoT protection assurances and accelerate IoT device deployment Nordic Semiconductor’s recently launched nRF9160™ System-in-Package (SiP) LTE-M/NB-IoT cellular IoT...
by Mike Benson | Feb 25, 2019 | Press Releases, Wireless
The nRF9160 from Nordic – significantly smaller, lower power, and has more security features than any other cellular IoT module launched to date for both LTE-M & NB-IoT applications. It also has a host of unique IoT-targeted features, is certified for global...
