TDK SmartMic – The next generation of MEMS microphone technology is here

Written by Mike Benson

July 14, 2020

 TDK-InvenSense latest mics, the T5818 and the T3902 represent the next generation of MEMS microphone technology, bringing you the best digital microphone technology in a bottom port configuration. With features like ultra-low power, and multi-mode functionality, they are perfect for your true wireless stereo, multi-mic arrays, mobile devices, and many more applications.


Microphone Arrays

With multiple mics configured in an array, the resulting beam pattern makes it easy for products like smart assistants to hear your voice commands from across the room.

Bluetooth Headsets

The smaller your bluetooth headset gets, the smaller the battery, which means our low power mics can help keep you chatting for longer.

Security Systems

Our high signal to noise ratio lets your security system notify you when someone is at the door, not when someone is driving down the street, giving you one less thing to worry about.


You want your voice to sound the best when you take a phone call and with our wide dynamic range and high sound to noise ratio, you’ll sound great, no matter the environment.

Products Details:



The T3902 is a low‐power, low‐noise digital MEMS microphone in a small package. The T3902 consists of a MEMS microphone element and an impedance converter amplifier followed by a fourth‐order Σ‐Δ modulator. The pulse density modulated (PDM) interface allows two microphones to be time multiplexed on a data line using a single clock.

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The T5818 is a Pulse Density Modulation (PDM) microphone with a dynamic range of 107dB at 590µA, the widest dynamic range in the industry at the lowest power, which allows for excellent acoustic performance in environments that shift from very quiet to very loud, such as far field voice pickup barge-in for Smart Speaker applications.

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T3902 & T5818 EVBs

These allow quick evaluation of the microphone performance & the small size and low profile of the flexible PCB enables direct placement of the microphone into a prototype or an existing design for an in situ evaluation.

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